Equipment
ViaCon TFM
   
Qualiline-C
   
Optronic microscope
Ceramic inspection
   
 
KIP 3D Inspection Equipement

 
  Features:  
 
  KIP 3D inspection is a 3D surface profilemeterimage scanning machine. Apply to PCB、WAFER、MEMS、IC-PACKAGING、MLCC、SOLAR BATTERY COATING、SOLDER BUMP、SMART CARD industries. KIP Ⅲ can precisely measure the topography, contour, roughness, tilting, coating, co-planarity of object, which allows you to control the stability of your production. You may use it in the laboratory and medical research. Furthermore the set-up time is very short and the operation is handy, it’s your best partner for quality assurance.
 
     
 
Resolution:
X/Y: 0.3um, Z: 0.001um
Speed:
10-15 second/ check point
Criteria:
Criteria 3D image, Topography, 2D profile, Via hole depth/width, Line/space width/height, warpage, roughness, co-planarity, straightness, flatness....
X/Y range
X/Y range:
510 x 610 mm
Z depth:
350 μmm
 
     
 
 
     
     
     
     
  KAITRONIC TECHNOLOGY CO., LTD.  
  Add:No.870, Sec. 3, Xinsheng Rd., Zhongli City, Taoyuan County 320, Taiwan  
E-mail:mailto:service@kaitronic.com
  TEL:+886-3-453-3569│FAX:+886-3-453-2113