Equipment
ViaCon TFM
   
Qualiline-C
   
Optronic microscope
Ceramic inspection
   
 
Abrasive wheel

 
     
 
●Cleaning / Deoxidizing-S series
Grinding material: SiC
Structure: Flap
Mesh: 400 / 600 / 800 / 1000
Dimension: 6” x 3” x 24” (special size can be provided)
Advantages: Long product life , consistent in  roughness, suitable for fine line process
 
   
 
●Remove of resin or copper -SC series
Grinding material: SiC
Structure: Flap
Mesh: 400 / 600 / 800 / 1000
Dimension: 6” x 3” x 24” (special size can be provided)
Advantages: Good evenness of roughness, high cleaning effect, high cutting strength even in drench condition.
Functions: Remove of resin after plugging, polish Cu surface after plating
 
   
 
●Deburring-C series
Grinding material: SiC
Structure: Flap
Mesh: 400 / 600 / 800 / 1000
Dimension: 6” x 3” x 24” (special size can be provided)
Advantages: C Serial rollers used for deburring offer considerably longer life and higher performance than comparable flap rollers.
 
   
 
●Reconditioning Pressplate-A series
Grinding material: AlO3
Structure: Flap
Mesh: 400 / 600 / 800 / 1000
Dimension: 6” x 3” x 24” (special size can be provided)
Advantages: Advantage: The objective of reconditioning pressplate is to remove resin remains which are attached to the surface after pressing the laminate respectively the multilayer on the pressplates
 
   
     
 
 
 
     
     
  KAITRONIC TECHNOLOGY CO., LTD.  
  Add:No.870, Sec. 3, Xinsheng Rd., Zhongli City, Taoyuan County 320, Taiwan  
E-mail:mailto:service@kaitronic.com
  TEL:+886-3-453-3569│FAX:+886-3-453-2113